LIS2DW12: always-on 3D accelerometer Application note
■This document is intended to provide usage information and application hints related to ST's LIS2DW12 motion sensor.
■The LIS2DW12 is a 3D digital accelerometer system-in-package with a digital I²C/SPI serial interface standard output, performing at 90 µA in high-resolution mode and below 1 µA in low-power mode. Thanks to the ultra-low noise performance of the accelerometer, the device combines always-on low-power features with superior sensing precision for an optimal motion experience for the consumer. Furthermore, the accelerometer features smart sleep-to-wakeup (activity) and return-to-sleep (inactivity) functions that allow advanced power saving.
■The device has a dynamic user-selectable full-scale acceleration range of ±2/±4/±8/±16 g and is capable of measuring accelerations with output data rates from 1.6 Hz to 1600 Hz. The LIS2DW12 can be configured to generate interrupt signals by using hardware recognition of free-fall events, 6D orientation, tap and double-tap sensing, activity or inactivity, and wake-up events.
■The LIS2DW12 has an integrated 32-level first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor.
■The LIS2DW12 is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
■The ultra-small size and weight of the SMD package make it an ideal choice for handheld portable applications such as smartphones, IoT connected devices, and wearables or any other application where reduced package size and weight are required.
|
|
|
|
Application note & Design Guide |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
January 2021 |
|
|
Rev 5 |
|
|
AN5038 |
|
|
1.1 MB |
- +1 Like
- Add to Favorites
Recommend
- Rosenberger and STMicroelectronics Cooperate to Develop a Unique High-Speed Contactless Connector Based on 60GHz Wireless Technology
- MTA Announces Partnership with STMicroelectronics for Smart Tractor
- STMicroelectronics and Sierra Wireless Collaborate to Simplify and Accelerate Connected IoT Solutions Deployment
- Eclipse Global Connectivity, Smiths Interconnect and ST Engineering IDirect Collaborate to Deliver a New Airborne ISR SATCOM Capability
- ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
- China Requires Automobile Manufacturers to Increase the Proportion of Domestic Chip Procurement
- Rosenberger‘s Innovative Contactless Connector RoProxCon can Bridge Construction-related Air Gaps and Has A High Interference Immunity
- New High Side Switch ICs with User-Definable Protection Achieve Optimized Performance in Automotive Applications
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
