656T SERIES Center Pad Connection Devices ZIF THERMALLY ENHANCED XSOP
■Compact size for maximum board density
■ Wide target area for easy entry and removal of IC leads
■ Dual face-wipe contacts for long, dependable life
■ Excellent component clearance under the socket
■ Four high corner standoffs for easy inspection and cleaning of the PC board
■ For temperatures up to 150°C; for higher temperature applications consult the factory
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656T SERIES 、 656T 、 656L1543212T 、 656L1543612T 、 656L1545212T 、 656L1542212T 、 656XXXXXXXXTXXX |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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02/06/18 |
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Revised 02/06/18 |
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204 KB |
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