BridgeSwitch Family Application Note: Triangular PCB vs. Slotted Linear PCB Configuration for Three-Phase Inverter Applications
■For 3-phase inverter applications, each InSOP-24C surface mount package dissipates a third of the total inverter losses. The heat distribution allows the construction of a motor drive without an external heat sink. Two exposed pads facilitate heat transfer from the power switches to the printed circuit board (PCB).
■The thermal performance is affected by the placement of the devices, the distance between them, the size of the copper-clad areas connected to the exposed pads, and the thickness of the copper used for heat sinking. In the PCB configurations previously evaluated for the whitepaper, "Impact of Printed Circuit Board Layout on Device Temperature in 3-Phase Inverters Using BridgeSwitch" , the results show an increase in the device case temperatures for the linear PCB configuration as seen in Figure 3. Due to the heat converging at the center, the middle device exhibits a higher case temperature compared to the adjacent devices.
■The linear PCB configuration offers a smaller and more compact PCB layout that is desirable for some applications. Slots were added between the BridgeSwitch devices to maximize the advantage of the linear device placement resulting in the slotted linear PCB configuration in Figure 4. This addition will prevent the heat from the adjacent devices from affecting the temperature of the middle IC.
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Application note & Design Guide |
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Please see the document for details |
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InSOP-24C |
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English Chinese Chinese and English Japanese |
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November 2020 |
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Rev. A |
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AN-91 |
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2 MB |
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