Solid State Switching for Next Generation Wireless Test Applications
■Rapid growth in the number of connected devices for next generation wireless applications is driving demand for faster, more innovative, and more cost-effective test solutions. The need for reduction in cost and improvement in test throughput is found both at the design verification stage as well as in high-volume production testing. Test engineers are looking for ways to reduce the number of device-under-test (DUT) connections and enable testing of multiple DUTs in parallel from a single test station. This is most often achieved by configuring RF switches in a switch matrix to automate the routing of test signals. This article will explore some of the key differences between the types of switches used in test applications. Switch matrix configurations will be discussed, and a real world switch matrix for a high-volume telecom test application described in detail.
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U2C-1SP2T-63VH 、 USB-2SP2T-DCH 、 USB-4SP2T-63H 、 SPI-SP10T-63 |
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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12/13/18 |
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Rev: OR |
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AN-80-023 |
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668 KB |
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