Hardware Design Considerations for MKW35A/36A/35Z/36Z Bluetooth Low Energy Devices
●This application note describes Printed Circuit Board (PCB) design considerations for the MKW35A, MKW36A, MKW35Z, and MKW36Z 40-pin HVQFN (6 × 6) and 48-pin Laminated QFN (LQFN-7 × 7) package. Included are layouts of the component copper layer, solder mask, and solder paste stencil.
●These recommendations are guidelines only and may need to be modified depending on the assembly house used and the other components on the board.
|
|
|
|
|
|
|
Application note & Design Guide |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
HVQFN;QFN;LQFN |
|
|
English Chinese Chinese and English Japanese |
|
|
10/2019 |
|
|
Rev. 3 |
|
|
AN12181 |
|
|
2.5 MB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
