Mounting Techniques, Lead Forming, and Testing of the MPX Series Pressure Sensors
■Freescale’s MPX series pressure sensors are silicon piezoresistive strain-gauges offered in a chip-carrier package (see Figure 1). The exclusive chip-carrier package was developed to realize the advantages of high-speed, automated assembly and testing. In addition to high volume availability and low cost, the chip-carrier package offers users a number of packaging options. This application note describes several mounting techniques, offers lead forming recommendations, and suggests means of testing the MPX series of pressure sensors.
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344C-01 、 344-15 、 344B-01 、 344F-01 、 344G-01 、 344E-01 、 344A-01 、 867-08 、 867B-04 、 867C-05 、 867F-03 、 867G-03 、 867E-03 、 MPX2300DT |
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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05/2008 |
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Rev 5 |
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AN936 |
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189 KB |
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