SG7350D Thermal Conductive RF PCB Used Laminate Material
■Glass-reinforcedPTFEand ceramic dielectric.
■Excellent high frequency performance.
■Enhanced thermal conductivity.
■Stable electrical properties versus frequency.
■Low Z-axis expansion and excellent dimensional stability.
■Compatible with lead-free process
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[ Passive Components ][ Power Amplifiers ][ Microwave Combiner ][ Power Dividers ][ LNA ][ LNB ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/06/07 |
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CN-TDS-2012-02-SG7350D |
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240 KB |
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