Metal, ceramic, plastic package products Precautions

PublishTime：2021-09-26

This document describes general precautions for using HAMAMATSU opto-semiconductors of metal, ceramic, and plastic packages (hereafter called“the product”). For precautions on handling image sensors, unsealed products (opto-semiconductors whose chip is exposed), refer to precautions of “image sensors”,“unsealed products” available from HAMAMATSU respectively.

Brand of Product：	HAMAMATSU
Part#：
Product Category：	opto-semiconductors More
Application：	More
Data Type：	User's Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2019/05/06
Version Number：
Data Encoding：	KXX-A12028 A
Data Size：	306 KB

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