Performing Sequential Peeling Extraction and De-Embedding with an Anritsu ShockLine™ Vector Network Analyzer

2021-09-23
★ Sequential peeling is a network extraction tool used for identifying and removing subsets of a structure that behave as localized pseudo-lumped-element reflection centers. It is particularly useful for electrically small structures with runs of transmission line, such as PC boards with isolated vias in the transmission lines. Sequential peeling identifies time domain elements and then fits a shunt admittance or series impedance model to the isolated data. For each lumped element, an .s2p file is generated that can be de-embedded to get between lumped defect areas. Once a series of these elements are identified, a more complete composite model of the structure can be obtained and de-embedded. This application note will examine some of the steps in the sequential peeling process.
★For this application note, a ShockLine MS46524B 43.5 GHz (option 43) vector network analyzer (VNA) with time domain (option 002) and universal fixture extraction (option 024) was used. The example is based on a Wildriver Technology demo board CMP-28 2.4 mm connector with four vias, as shown in Figure 1.

ANRITSU

MS46524B

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Vector Network Analyzer

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Application note & Design Guide

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English Chinese Chinese and English Japanese

2020-02

Rev. A

11410-01166

636 KB

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