ESD Protection Overview
■The main purpose of "On-Chip" ESD protection is to protect the IC against an ESD event during the manufacturing environment of the IC
■Supplementary ESD protection is required for system level/application ESD events
■Low capacitance to maintain signal integrity for high speed data ports
■Minimize parasitic inductance to maximize performance of ESD device
■GcDiode™ is similar in performance to the TVS Diode
|
|
|
|
|
|
|
Technical Documentation |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2020/04/24 |
|
|
|
|
|
|
|
|
922 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
