EVAL-ADCA3270 Evaluating the ADCA3270 DOCSIS 3.1 Power Doubler Amplifier, 45 MHz to 1218 MHz
The ADCA3270-EVALZ evaluation board consists of a 2-layer printed circuit board (PCB) fabricated from a 32 mil laminate mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the device as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management. The ADCA3270-EVALZ is populated with components to interface the IC to a typical CATV application. J1 (RF_IN) and J2 (RF_OUT) are 75 Ω, N type, male connectors. There spective RF traces of the ports have a 75 Ω characteristic impedance. The ADCA3270-EVALZ is populated with components suitable for use over the −30°C to +110°C operating temperature range of the ADCA3270.
Access to VCC and GND is through a 3-pin header (P1) on the ADCA3270-EVALZ. The TSEN pin monitors the on-chip thermistor voltage. RF traces are 75 Ω microstrip. Package ground leads and the exposed paddle connect directly to the ground plane. Multiple vias connect the LGA_CAV ground paddle to the bottom ground plane to provide adequate electrical conduction and thermal conduction to the heat sink. The transfer of heat from the ADCA3270-EVALZ ground to the heat sink is further facilitated by the insertion of a piece of indium approximately the footprint of the LGA_CAV between the ADCA3270-EVALZ bottom and the heat sink. There are no components on the bottom side of the PCB. Consult the ADCA3270 data sheet in conjunction with this user guide when using the ADCA3270-EVALZ evaluation board.
●FEATURES:
■2-layer evaluation board with heat sink
■75 Ω RF male connectors
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User's Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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7/2021 |
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Rev. 0 |
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UG-1931;UG26042-7/21(0) |
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304 KB |
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