THJP ThermaWickTM Thermal Jumper Surface Mount Chip

2021-09-13
●THJP surface mount chips are designed to provide an electrically isolated thermal conductive pathway to a ground plane or heat sink while maintaining the electrical isolation of the device. The devices are constructed with aluminum nitride substrates in both SnPb and Pb-free wraparound termination styles. The low capacitance of the device makes them an excellent choice for high frequency and thermal ladder applications. Custom sizes available.
●FEATURES
■Electrically isolated thermal conductor
■High thermal conductivity AlN substrate (170 W/mK)
■Electrically isolated terminations (> 999 MΩ)
■Low capacitance
■Available with SnPb or lead (Pb)-free wrap terminations

VISHAY

THJPTHJP 1206THJP1206AST1

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ThermaWickTM Thermal Jumper Surface Mount Chip

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Power supplies ]converters ]RF amplifiers ]Synthesizers ]Switch mode power supplies ]Pin diodes ]laser diodes ]Filters ]Component to heat sink ]Component to case ]Component to ground plane ]Pad to pad ]Pad to via ]Pad to trace ]

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English Chinese Chinese and English Japanese

18-Mar-2021

Revision: 18-Mar-2021

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