DF37NC(1.5)-24DS-0.4V(51) Drawing
● 1. ALL LEADS CO-PLANARITY SHALL BE 0.1 mm MAX.
● 2. CONTACT PLATING SPECIFICATIONS.
▲ CONTACT AREA: GOLD 0.05 μm MIN.
▲ SMT LEAD: GOLD 0.05 μm MIN.
▲ UNDERPLATING: NICKEL 1 μm MIN.
▲ (SURFACE: SEALING)
● 3. RECOMMENDED REFLOW TEMPERATURE PLOFILE USING LEAD-FREE SOLDER PASTE.
● 3. THIS TEMPERATURE PROFILE IS PER THE CONDITIONS SHOWN ABOVE. ADDITIONAL FACTORS. SUCH AS SOLDER PASTE TYPE. PCB SIZE AND OTHER MOUNTED COMPONENTS COULD AFFECT THE PROFILE. THEREFORE. A THOROUGH EVALUATION OF MOUNTING CONDITION IS REQUIRED PRIOR TO PRODUCTION. TEMPERATURE IS MEASURED AT CONTACT LEAD.
● 4. PER REEL 5000 CONNECTORS.
● 5. THE DIMENSIONS IN PARENTHESES ARE FOR REFERENCE.
● 6. REFER TO JIS C 0806 (PACKING OF COMPONENTS FOR AUTOMATIC HANDLING)
● 7. DETAIL OF PART NO. LABEL IS WRITTEN IN JAPANESE.
● 8. AFTER FINISHING THE REELING, COVER THE SURFACE WITH 2 METERS OF REINFORCING COLLAR AND THE DOWN AT THE END.
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Outline Dimension Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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11.11.07 |
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EDC3-339438-01 |
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342 KB |
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