EPC2001C Product / Process Change Notification (PCN)(PCN210601)
●Description of Change:
EPC announces the qualification of RAYTEK for PbF (lead free) wafer bump process. RAYTEK is approved as a wafer bump assembly site for the released to sales part numbers identified in Appendix I. There will be no change in manufacturing technology or to the package dimensions. This change does not affect the form, fit, function of the product as defined in the datasheet.
Successful qualification testing of the RAYTEK facility was performed to ensure product quality and reliability requirements are met or exceeded. RAYTEK is an existing qualified supplier for other EPC devices including commercial and AEC products. Additional qualification information is included in Appendix II
RAYTEK will begin production of EPC products in Appendix I on or after June 6, 2021. Products with date code 2124 and afterward could be produced by RAYTEK. During the transition period customers may receive shipments from any approved EPC assembly site. Shipment of such products to a customer will only occur after the customer PCN is signed off.
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EPC2001C 、 EPC2007C 、 EPC2010C 、 EPC2012C 、 EPC2014C 、 EPC2016C 、 EPC2019 、 EPC8002 、 EPC8004 、 EPC8009 、 EPC8010 |
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PCN/EOL |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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June 25, 2021 |
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PCN210601 |
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257 KB |
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