Thermal Management of Delphi IPM series Power Modules
This application note discuss the thermal management of Delphi IPM series power module which includes the thermal performanee comparison of the two different packages, the copper pad enhancement in IPM power modules, and the enhancement from the different sized attachment area.
Power Modules 、 non-isolated, fully integrated Point-of-Load (POL) power modules |
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Application note & Design Guide |
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Please see the document for details |
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SIP;SMD |
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English Chinese Chinese and English Japanese |
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February 2005 |
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AN-3 |
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355 KB |
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