SP337EUEY-L PCN 20006 PRODUCT/PROCESS CHANGE NOTICE (PCN)
■ MaxLinear has qualified TSMC|Fab 10 wafer foundry in Shanghai in order to facilitate long term support of the product line. The wafer process is 0.25um CMOS High Voltage Mixed Signal.
● There is no change to form, fit, orfunction other than the exceptions noted below:
■ t(DZZV) Shutdown to Driver Output Valid changes from (typ 100ns, max 400ns) to (max 30us)
■ t(RZZV) Shutdown to Receiver Output Valid changes from (typ 100ns, max 800ns) to (max 30us)
● No change to assembly location, package BOM, device reliability.
● Note: Users who rely on DC, diode characteristics during ICT testing should take caution certain I/O characteristics may appear changed due to the proprietary I/O structures employed by TSMC. These DC / diode characteristic differences are not guaranteed nor required to ensure full design functionality per datasheet. Adjustments at ICT testing may be required to prevent false failures.
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PCN/EOL |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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September 18, 2020 |
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Revision 5.0 |
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PCN 20006 |
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127 KB |
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