SP211ECA-L/TR PCN 20014 PRODUCT/PROCESS CHANGE NOTICE (PCN)
■ MaxLinear has qualified TSMC Fab 10 wafer foundry in Shanghai in order to facilitate long term support of the product line. The wafer process is 0.25um CMOS High Voltage Mixed Signal. The process has been optimized to produce very similar product characteristics as the currently shipping devices from Silan foundry and will meet existing datasheet specifications with the below exceptions.
▲ Abs. Max Rx Input voltage range (RIN) changes from ±20V to ±25V
▲ RS-232 Output voltage swing changes from Typical = ±7V to ±8.7V
▲ RS-232 input Voltage rangechanges from Min=-15V, Max = +15V to Min = -25V to Max = -+25V
▲ Icc no load changes from max = 6mA to 8mA
▲ Icc RL = 3kΩ changes from typical = 15mA to 23mA
● There are no changes to assembly location.
● There are no changes in the package BOM.
● There are no changes in device reliability.
● Note: Users who rely on DC, diode characteristics during ICT testing should take caution certain I/O characteristics may appear changed due to the proprietary I/O structures employed by TSMC. These DC / diode characteristic differences are not guaranteed nor required to ensure full design functionality per datasheet. Adjustments at ICT testing may be required to prevent false failures.
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PCN/EOL |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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January 26, 2021 |
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Revision 5.0 |
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PCN 20014 |
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185 KB |
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