SDM02U30LPS Schottky Diode uses 66% less PCB space
●Typically measuring just 0.62mm x 0.32mm x 0.30mm,the DFN0603 packaged Schottky uses around 66% less board space than the industry standard DFN1006 and SOD923 alternatives.Furthermore, it has an off-board profile of just 0.35mm,some 25% thinner than competing solutions.
●To ensure that power losses are minimized and portable battery lifetime is maximized,the SDM02U30LP3 is characterized by a very low forward voltage of 0.37V and a maximum leakage current of only 7μA.
●The Diodes’ Advantage
■0.18mm² Footprint
▲The DFN0603-2 package occupies 70% less PCB space than the current industry standard DFN1006-2 and SOD923 packages empowering high density designs.
■0.35mm package profile
▲The DFN0603-2 has an off board profile that is 25% thinner than DFN1006 and SOD923 making it ideal for ultra-portable applications.
■Low V-F
▲Very low forward voltage minimises power dissipation
■Low Leakage Low leakage
▲minimises reverse losses and extends battery life
■Thermally efficient package
▲Low junction to ambient thermal resistance (Rthj-a) support power dissipation upto 0.25Watts
[ Smart phones ][ Tablet PC’s ][ Headsets ][ Thin LED TV ][ Hearing Aids ][ Medical Electronics ] |
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Supplier and Product Introduction |
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Please see the document for details |
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DFN0603;DFN0603-2 |
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English Chinese Chinese and English Japanese |
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October 2012 |
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Issue 001 |
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236 KB |
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