BIS-6660 B Fanless Embedded Barebone Based on Intel H61/Q77/B75 Chipset
●Based on Intel H61/Q77/B75 chipset, support Intel Sandy/Ivy Bridge Core i3/i5/i7 Celeron series processor
●2x SO-DIMM, support DDR3 1600MHZ, up to 16GB
●1x VGA, 1x DVI display output, support independent dual display
●2x Gigabit Ethernet port, support Wake on LAN
●Support 6x COM port, and 2x USB3.0、4x USB2.0, 1x Audio, and 1x KB、1x MS
●The second generation ICEFIN structure, fanless design, support fast installation, easy installation and maintenance
|
|
Datasheet |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
2021/03/31 |
|
|
|
|
|
1.5 MB |
- +1 Like
- Add to Favorites
Recommend
- METZ CONNECT Offers FO Connectors with Grade B and a Max. Insertion Loss of 0.25dB
- WAYON TVS WSxxP30SMC(-B)-AT Series in SMC (8.0×6.0×2.5mm) Package, the “Invisible Escort“ of New Energy Vehicles
- Renesas Introduces New ASIL B Power Management IC RAA271082 Ideal for Automotive Camera Applications
- ATP Electronics Introduces PCIe 4.0x2 CFexpess Type B Cards for High-Speed Imaging/Video Applications
- SOCAY Lanuched the NTC Thermistor SN0402X103F3950FB with 0402 Patch Package and the Temperature Detection Accuracy of can be ±0.1℃
- ATP N600Si/Sc PCIe Gen 4 x2 NVMe CFexpress Card:High-Speed Removable Storage for Industrial Applications
- MindMotion Arm Cortex-M0 Core Microcontrollers‘ Self-Diagnostic Library Certified According to IEC 60730-1 and IEC 60335-1
- Alliance Memory Introduced Die Version for 2Gb and 4Gb DDR3 and DDR3L SDRAMs Providing New Memory Chip Source in Face of Market Shortages
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.