NC Series Thin Film Single Value Chip and Wire Capacitors
Parts require epoxy or eutectic die attach to substrate and one wire bond.
These chips are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The NC’s are 100 % electrically tested and visually inspected to MIL-STD-883.
●FEATURES:
■Wire bondable
■Small size: 0.020 inches square to 0.060 inches square
■Substrate: silicon with gold backing
■Dielectric: silicon dioxide / silicon nitride
■Capacitance range: 0.5 pF to 1000 pF
NC Series 、 NCBB 、 NCCC 、 NCDD 、 NCEE 、 NCAA4700CKMAHWS 、 NCEE10000KNGKWS 、 NCAA 、 NC |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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08-Apr-2021 |
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Revision: 08-Apr-2021 |
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61033 |
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92 KB |
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