PPH15X_20 PUSHING GaAs pHEMT TO THE LIMIT

2021-06-11
This power technology includes two metal interconnect layers, precision TaN resistors, high value TiWSi resistors, MIM capacitors (high density and over via), air bridges and backside via holes.
●Unique technology performance on the market:
■Very high power density: 800mW/mm@3dBc
■High linearity: IMR3 of 56dBc@10dB backoff
■High PAE
■High gain
■BCB coating available for plastic molded packaging

UMS

PPH15X_20CHA6550-QXGCHA6652-QXGCHA6653-QXGCHA6194-QXGCHA5659-QXG

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Part#

interconnect layersprecision TaN resistorshigh value TiWSi resistorsMIM capacitorsair bridgesbackside via holes

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Satcom ]Radiolinks ]Radar ]Fiber optics ]Instrumentation ]

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Supplier and Product Introduction

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Please see the document for details

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QFN

English Chinese Chinese and English Japanese

2021/06/01

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