CSD Ceramic Sandwich, Dual-In-Line Thin Film Resistor,Through Hole Network (Custom)
● Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
● Monolithic construction
● Ceramic package with no cavity. 4 pins to 20 pins.
● Flexibility of lead variations to save PC board space
■Note:
●This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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17-Mar-2020 |
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Revision: 17-Mar-2020 |
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60046 |
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100 KB |
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