770194 PIN, GROUNDING, UNIVERSAL MATE - N - LOK(TM) II CUSTOMER DRAWING

2023-04-20
●1 0.00076[.000030] MIN GOLD AT POINT OF MEASUREMENT IN THE LOCALIZED GOLD PLATE AREA, 0.00127[.000050] MIN TIN-LEAD IN THE TIN-LEAD PLATE AREA, 0.00127[.000050] MIN NICKEL UNDERPLATE ON ENTIRE CONTACT.
●2 WIRE RANGE: 0.5-2mm² [ 20-14] AWG.
INSULATION RANGE: 3.30-5.08[.130-.200] DIA.
●3 DIMENSIONS IN BRACKETS ARE IN INCHES.
●4 0.00076[.000030] MIN GOLD AT POINT OF MEASUREMENT IN THE LOCALIZED GOLD PLATE AREA, 0.00127[.000050] MIN TIN IN TIN PLATE AREA, 0.00127[.000050] MIN NICKEL UNDERPLATE ON ENTIRE CONTACT.
●5 SUPERSEDED BY 1-770194-0

TE Connectivity

1-770194-0770194-1

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PIN

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English Chinese Chinese and English Japanese

11DEC2013

REV K

C-770194

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