AMP 2.5mm Pitch HPI High Performance Interconnect (Low Cost) Wire-To-Board System
This specification covers the requirements for crimping of 2.5mm pitch HPI (High-Performance Interconnect Wire-To -Board System) Connector (Crimp Type) for the applicator and manually operated hand tool.
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User's Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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27-NOV-00 |
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Rev. A |
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114- 57004 |
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121 KB |
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