Mini ICT with VTEP Accurately Detects Solder Failure on SMT Connector Despite No Probe Access Case Study
■Sufficient channels for test at an affordable price
■Accurate detection of repetitive solder failure on boards
■Reduction in future board failures by the same root cause
■Significant savings resulting from a reduction in bone pile anda decrease in scrap cost
■Increase functional test yield
●Benefits:
■The swift path to resolution as well as the Mini ICT’s affordability were strong factors to the customer’s purchase decision from Keysight. Since 2016, the customer has purchased 6 Keysight Mini ICT systems. The insight made possible by the Mini ICT helped the customer with effective fault isolation, leading to the implementation of fixes that increased throughput.
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Case Study |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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July 24, 2017 |
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5992-2470EN |
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873 KB |
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