Tpcm™ 780 High Performance TIM
■Tpcm™ 780 is a high performance, inherently tacky, easy to rework phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today’s demanding processors.
■Tpcm ™ 780 is a silicone-free material that begins to further soften and flow at approximately 45ºC. This minimizes contact thermal resistance by filling the microscopic irregularities of the components it contacts. Designed with a specialty polymeric matrix which does not fully change phase, Tpcm™ 780 drastically minimizes migration (pump out)over thermal greases and other phase change materials.
■Tpcm™ 780 reliability has been demonstrated though exposure to 2000 hours of various aging tests resulting in proven dependability at an operating temperature of 125°C.
●FEATURES & BENEFITS:
■Silicone-free for applications that are silicone sensitive
■No mess due to thixotropic characteristics which prevent flow outside of interface
■Very soft at room temperature, therefore less stress on board
■RoHS Compliant
■4V0 UL Flammability Rating
■Naturally tacky at room temperature, requiring no adhesive
●AVAILABILITY:
■Sheets and Die Cuts
■Die cut on strips w/tabs
■Die cut on rolls w/tabs
■Production Volume Manufacturing:
▲Designed for use with the TIM Print
▲Refer to “TIM Print Application Guide”
●STORAGE CONDITIONS:
■Store in original packaging or a light-proof package
■Store at 0-30⁰C & maximum 50% RH
■Shelf Life: 1 year from date of shipment when stored at above conditions
[ Semiconductor Packaging ][ Graphics Card ][ Notebooks ][ Desktops ][ Servers ][ IGBTs ][ Automotive ][ Memory Modules ][ Game Consoles ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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0321 |
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THR-DS-TPCM-780-0321 |
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293 KB |
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