1437539-2 DIP SOCKET, 800 SERIES CUSTOMER DRAWING
2023-04-20
●MATERIALS:
■INSULATOR: POLYESTER, UL RATED 94V-0
■CONTACT:
▲800 & 1800 SERIES CONTACT: 4 BEAM, COPPER ALLOY, MACHINED (PREMIUM VERSION) OR FORMED (ECONOMY VERSION, WITH SUFFIX -ES OR -ESL).
▲800 SERIES HIGH RETENTION CONTACT: 4 BEAM, COPPER ALLOY, MACHINED.
▲1000 SERIES CONTACT: 6 BEAM, COPPER ALLOY, MACHINED (LOW INSERTION FORCE SERIES)
■SLEEVE- ALL SERIES: COPPER ALLOY, FORMED
●ELECTRICAL:
■CONTACT RESISTANCE: 10 MILLIOHMS MAX
■CONTACT RATING: 3 AMPS
■CAPACITANCE: 1.0 pF PER MIL-STD-202, METHOD 305 INSULATION RESISTANCE: 5000 OHMS MIN @ 500 VDC PER MIL-STD-1344, METHOD 3003.1
■DIELECTRIC WITHSTANDING VOLTAGE: 1000 VOLTS (RMS) PER MIL-STD-1 344, METHOD 3001.1
●MECHANICAL:
■AFTER INSERTION FORCE: 37 GRAMS AVG (6 BEAM CONTACT) 134 GRAMS AVG (4 BEAM PREMIUM) 179 GRAMS AVG (4 BEAM ECONOMY) AND 334 GRAMS AVG (HIGH RETENTION)
■AFTER WITHDRAWAL FORCE: 15 GRAMS AVG (6 BEAM CONTACT) 63 GRAMS AVG (4 BEAM PREMIUM OR ECONOMY) AND 245 GRAMS AVG (HIGH RETENTION)
●ENVIRONMENTAL: OPERATING TEMPERATURE: -55°C TO -105°C
●PLATING: 25μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 5μ'' MIN GOLD OVER 50μ'' MIN NICKEL SLEEVE.
●PLATING: 25μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN TIN-LEAD OVER 50μ'' MIN COPPER SLEEVE.
●PLATING: 80μ'' MIN TIN-LEAD OVER 75μ'' MIN COPPER CONTACT WITH 180μ'' MIN TIN-LEAD OVER 75μ'' MIN NICKEL SLEEVE.
●PLATING: 5μ'' MIN GOLD FLASH OVER 50μ'' MIN NICKEL CONTACT WITH 5μ'' MIN GOLD FLASH OVER 50μ'' MIN NICKEL SLEEVE.
●PLATING: 5μ'' MIN GOLD FLASH OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN TIN-LEAD OVER 50, MIN COPPER SLEEVE.
●PLATING: 7.5μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN TIN-LEAD OVER 50μ'' MIN COPPER SLEEVE.
●PRELIMINARY PART - NOT RELEASED FOR PRODUCTION.
●806-AGXXD-XXX SERIES IS SUPERSEDED BY 506-AGXXD-XXX SERIES (REFER TO CUSTOMER DRAWING 1437532-2)
●PLATING: 25μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN MATTE TIN OVER 50μ'' MIN COPPER SLEEVE.
●PLATING: 80μ'' MIN MATTE TIN OVER 75μ'' MIN COPPER CONTACT WITH 180μ'' MIN MATTE TIN OVER 75μ'' MIN NICKEL SLEEVE.
●PLATING: 5μ'' MIN GOLD FLASH OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN MATTE TIN OVER 50μ'' MIN COPPER SLEEVE.
●PLATING: 7.5μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN MATTE TIN OVER 50μ'' MIN COPPER SLEEVE.
●OBSOLETE PARTS: OBSOLETE CIS STREAMLINING PER D.RENAUD/D.SINISI
■INSULATOR: POLYESTER, UL RATED 94V-0
■CONTACT:
▲800 & 1800 SERIES CONTACT: 4 BEAM, COPPER ALLOY, MACHINED (PREMIUM VERSION) OR FORMED (ECONOMY VERSION, WITH SUFFIX -ES OR -ESL).
▲800 SERIES HIGH RETENTION CONTACT: 4 BEAM, COPPER ALLOY, MACHINED.
▲1000 SERIES CONTACT: 6 BEAM, COPPER ALLOY, MACHINED (LOW INSERTION FORCE SERIES)
■SLEEVE- ALL SERIES: COPPER ALLOY, FORMED
●ELECTRICAL:
■CONTACT RESISTANCE: 10 MILLIOHMS MAX
■CONTACT RATING: 3 AMPS
■CAPACITANCE: 1.0 pF PER MIL-STD-202, METHOD 305 INSULATION RESISTANCE: 5000 OHMS MIN @ 500 VDC PER MIL-STD-1344, METHOD 3003.1
■DIELECTRIC WITHSTANDING VOLTAGE: 1000 VOLTS (RMS) PER MIL-STD-1 344, METHOD 3001.1
●MECHANICAL:
■AFTER INSERTION FORCE: 37 GRAMS AVG (6 BEAM CONTACT) 134 GRAMS AVG (4 BEAM PREMIUM) 179 GRAMS AVG (4 BEAM ECONOMY) AND 334 GRAMS AVG (HIGH RETENTION)
■AFTER WITHDRAWAL FORCE: 15 GRAMS AVG (6 BEAM CONTACT) 63 GRAMS AVG (4 BEAM PREMIUM OR ECONOMY) AND 245 GRAMS AVG (HIGH RETENTION)
●ENVIRONMENTAL: OPERATING TEMPERATURE: -55°C TO -105°C
●PLATING: 25μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 5μ'' MIN GOLD OVER 50μ'' MIN NICKEL SLEEVE.
●PLATING: 25μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN TIN-LEAD OVER 50μ'' MIN COPPER SLEEVE.
●PLATING: 80μ'' MIN TIN-LEAD OVER 75μ'' MIN COPPER CONTACT WITH 180μ'' MIN TIN-LEAD OVER 75μ'' MIN NICKEL SLEEVE.
●PLATING: 5μ'' MIN GOLD FLASH OVER 50μ'' MIN NICKEL CONTACT WITH 5μ'' MIN GOLD FLASH OVER 50μ'' MIN NICKEL SLEEVE.
●PLATING: 5μ'' MIN GOLD FLASH OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN TIN-LEAD OVER 50, MIN COPPER SLEEVE.
●PLATING: 7.5μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN TIN-LEAD OVER 50μ'' MIN COPPER SLEEVE.
●PRELIMINARY PART - NOT RELEASED FOR PRODUCTION.
●806-AGXXD-XXX SERIES IS SUPERSEDED BY 506-AGXXD-XXX SERIES (REFER TO CUSTOMER DRAWING 1437532-2)
●PLATING: 25μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN MATTE TIN OVER 50μ'' MIN COPPER SLEEVE.
●PLATING: 80μ'' MIN MATTE TIN OVER 75μ'' MIN COPPER CONTACT WITH 180μ'' MIN MATTE TIN OVER 75μ'' MIN NICKEL SLEEVE.
●PLATING: 5μ'' MIN GOLD FLASH OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN MATTE TIN OVER 50μ'' MIN COPPER SLEEVE.
●PLATING: 7.5μ'' MIN GOLD OVER 50μ'' MIN NICKEL CONTACT WITH 80μ'' MIN MATTE TIN OVER 50μ'' MIN COPPER SLEEVE.
●OBSOLETE PARTS: OBSOLETE CIS STREAMLINING PER D.RENAUD/D.SINISI
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