ELCON MICRO WIRE-TO-BOARD POWER SOLUTIONS

2021-04-22
TE Connectivity’s (TE) ELCON Micro wire-to-board power solutions can provide a high current up to 12.5A per pin in the common industry footprint of 3.0mm. This current density in a compact design is useful for servers, switches, storage devices and testing machines. A standard industry footprint of connectors and plug kits allows for easy upgrades to existing designs and makes our headers PCB footprint compatible with other suppliers. Custom cable assemblies help complete our high current portfolio allowing design flexibility.
●Benefits:
■ High current density up to 12.5A per pin maximum in the common industry footprint of 3.0mm (contact pitch)
■ Common industry footprint allows for easy upgrades to existing designs
■ Support 2 to 24 pin configurations and different currents with multiple combinations of different wire sizes
■ PCB footprint compatible with other suppliers
■ Easy assembly with virtually fool-proof mating features
■ Perform reliably in harsh environments with maximum operating temperature of 105℃
■ Made with halogen-free material
■ Low contact resistance of 5mΩ max provides lower temperature rise and lower power loss
■ Plug kits and custom cable assemblies help complete our high current portfolio allowing design flexibility

TE Connectivity

1-2204801-83-2204801-87-2204801-81-2204749-82204748-22204748-42204748-82354120-12354149-12354173-1

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Part#

Vertical headerCable terminalCable housingCable Assembly

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Servers ]Switch ]Routers ]Power supplies and distribution ]Gaming Machines ]Printers ]Security Systems ]Business retail equipment ]BRE ]Dryers ]Refrigerator ]Test Equipment ]Measurement Equipment ]Diagnostic equipment ]Patient Monitor ]

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Datasheet

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07/19

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