ROGERS KEEPS ULTRA-THIN NOTEBOOK COOL TO THE TOUCH
With the continued demand for portable electronics devices to be slimmer and more powerful, heat management solutions have become more important and more challenging. Recently, a team of OEM designers encountered a host of such challenges during the design phase of a high-end notebook for the enterprise market.Their new fan-less design would help them realize an ultra-slim device profile, but thermal management had the potential to be a serious problem. The question was how to manage the heat generated by the high-performance components, like the CPU and ultra-thin display, without taking up valuable real estate inside the notebook. Poor heat management around these device components could lead to negative effects such as thermal throttling (CPU slow down) or device shutdown. From a user experience perspective, they were also concerned that users might feel excess heat or burn. With limited space to work with, finding a thin, robust heat management solution would be critical to user comfort and device performance.
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