Manufacturing Site Alternate - Assembly WLCSP Tape and Reel at Chipbond（PCN210301）
EPC announces the qualification of Chipbond for WLCSP Tape and Reel Assembly. Chipbond is approved as a back-end di cing and tape and reel assembly site for the released to sales part numbers identified in Appendix I. There will be no change in manufacturing technology or to the package dimensions. This change does not affect the form, fit, function of the product as defined in the datasheet.
Successful qualification testing of the Chipbond facility was performed to ensure product quality and reliability requirements are met or exceeded.
Chipbond will begin production of EPC products in Appendix I on or after March 8, 2021. Products with date code 2111 and afterward could be produced by Chipbond. During the transition period customers may receive shipments from any approved EPC assembly site. Shipment of such products to a customer will only occur after the customer PCN is signed off.
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EPC2202 、 EPC2203 、 EPC2206 、 EPC2212 、 EPC2214 、 EPC2216 、 EPC2219 |
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PCN/EOL |
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Please see the document for details |
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WLCSP |
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English Chinese Chinese and English Japanese |
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March 23, 2021 |
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PCN210301 |
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221 KB |
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