D12S1R860D, Non-Isolated, Power Block DC/DC Power Modules: 7.0~13.2Vin, 0.6V~1.8V/60A, 2.5V/55A, 3.3V/50A DATASHEET
●The Delphi D12S1R860D, surface mounted, power block is the latest offering from a world leader in power systems technology and manufacturing — Delta Electronics, Inc. The D12S1R860D is the latest offering in the DXP60 family which was developed to address the ever-growing demands of increased current and power densities in networking applications while providing maximum flexibility for system configuration, its benefits can easily be applied to other applications transcending various market segments. The DXP60 family, containing all necessary power components and boasting of a USABLE (55˚C, 200LFM) current density of 120A/in2 and a power density of up to 680W/in3, is a building block for a new open Digital Power Architecture developed to work with either digital or analog controllers. Measured at 0.5”Wx1.0”Lx0.48”H and rated at 60A of output current, the D12S1R860D is designed to operate with an input voltage from 7V to 13.2V and provide an output voltage adjustable from 0.6V to 3.3V. Each D12S1R860D contains two power trains which can provides either an interleaved single output, or two independent outputs. Multiple D12S1R860D can be used in parallel to serve applications where output currents are in excess of 60A with limitation imposed only by the control circuit, analog or digital. Designed for superior price/performance, the D12S1R860D can provide 1.8V and 60A full load in ambient temperature up to 55˚C with 200LFM airflow.
●FEATURES:
■High efficiency:
▲94.1%@ 11Vin, 3.3V/50A out
▲92.8%@ 11Vin, 2.5V/55A out
▲91.5%@ 11Vin, 1.8V/60A out
▲88.0%@ 11Vin, 1.0V/60A out
▲83.0%@ 11Vin, 0.6V/60A out
■High accuracy current sense resistor ±1% tolerance@25ºC; 300PPM/ºC
■Small size and low profile:
■25.4x12.7x12.2mm
■(1.00” x 0.50” x 0.48”) (SMD)
■Surface mount
■No minimum load required
■Input UVLO, Output OCP/SCP, OVP
■Parallel Units
■ISO 9000, TL 9000, ISO 14001 certified manufacturing facility
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[ Telecom ][ DataCom ][ Distributed power architectures ][ Servers ][ workstations ][ LAN application ][ WAN application ][ Data processing application ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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06082016 |
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2.1 MB |
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