Tflex™ HD300 Series Thermal Gap Filler

2020-06-28

Laird TflexTM HD300 is a 2.7 W/mK gap filler material in Laird’s high deflection line of products. Tflex HD300 is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with Tflex HD300 while generating minimal board and component stress. Laird’s unique manufacturing capabilities, and filler and resin knowledge result in this unique product designed withcustomer applications in mind.
Tflex HD300 material exhibits excellent surface wetting characteristics and high deflection propertiesensuring low contact resistances and providing an overall lower total thermal resistance.
A Tgard™ liner at one side option is provided to form into Tflex HD300TG, offer guaranteed >6KV AC dielectric barrier, is cut-through resistant and enables easy non-tacky handling at one side.
A Tgard™ liner in the middle option is provided to form into Tflex HD300MTG for 40mil and above thicknesses, offer guaranteed >6KV AC dielectric barrier, has cut-through resistant and two-sided tackiness.
FEATURES AND BENEFITS :
•2.7 W/m K thermal conductivity .
•Low pressure versus deflection characteristics .
•Excellent surface wetting for low contact resistance. •Minimizes board and component stress.
•Large tolerance applications.
•RoHS and REACH compliant.

Laird

Tflex HD300Tflex HD300TGTflex HD340Tflex HD360Tflex HD380Tflex HD3100Tflex™ HD300Tflex HD3100DC1Tflex HD360TGTflex HD380MTGTflexHD360TflexHD380TflexHD3100HD3xxxHD300

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Thermal Gap Filler

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