【EOL】Central Semiconductor The CP375 wafer process has been discontinued and is being replaced with the CP406 wafer process (PCN #190)
●Parts Affected:Chip process CP375, N-channel MOSFETs, wafers and bare die.
●Extent of Change:The CP375 wafer process has been discontinued and is being replaced with the CP406 wafer process.
●Reason for Change:The CP375 wafer process has been replaced in order to enhance manufacturing process controls and device performance. This change will help ensure an undisrupted supply of product.
●Effect of Change:The CP406 wafer process meets all electrical specifications of the individual devices listed on the following page.
●Effective Date of Change:Existing inventory of chip process CP375 will be shipped until depleted.
●Sample Availability:Please contact your salesperson or manufacturer’s representative for samples.
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CP375 、 CP406 、 CWDM3011N 、 CP375-CWDM3011N-CT 、 CP375-CWDM3011N-WN |
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PCN/EOL |
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Please see the document for details |
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TO-220 |
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English Chinese Chinese and English Japanese |
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June 19, 2020 |
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PCN #190 |
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