【EOL】Central Semiconductor The CP771 wafer process has been discontinued and is being replaced with the CP805 wafer process (PCN #191)
●Parts Affected:Chip process CP771, P-channel MOSFETs, wafers and bare die.
●Extent of Change:The CP771 wafer process has been discontinued and is being replaced with the CP805 wafer process.
●Reason for Change:The CP771 wafer process has been replaced in order to enhance manufacturing process controls and device performance. This change will help ensure an undisrupted supply of product.
●Effect of Change:The CP805 wafer process meets all electrical specifications of the individual devices listed on the following page.
●Effective Date of Change:Existing inventory of chip process CP771 will be shipped until depleted.
●Sample Availability:Please contact your salesperson or manufacturer’s representative for samples.
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CP771 、 CP805 、 CXDM4060P 、 CP771-CXDM4060P-CT 、 CP771-CXDM4060P-WN |
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PCN/EOL |
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Please see the document for details |
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TO-220 |
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English Chinese Chinese and English Japanese |
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June 19,2020 |
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PCN #191 |
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369 KB |
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