【PCN】Silicon Labs Addendum to 200526786 BGM13P/MGM13P Datasheet v1.2 MGM13P and v1.21 BGM13P Process Change Notice (200602791)
●Description of Change:
This addendum to 200526786 is to correct the existing part numbers. BGM13S/MGM13S part numbers are not affected and are removed from this addendum.
Original PCN Change Description:
Silicon Labs is pleased to announce new data sheet versions v1.2 for MGM13P and v1.21 for BGM13P. The updates include new package and landing pattern dimensions and addition of the certification ID in Korea
For the BGM13P compared to the previous datasheet version 1.2, the changes in v1.21 datasheet are
●In the front page block diagram, the lowest energy mode for LETIMER updated.
●Removed Wake On Radio references wherever applicable since this feature is not supported by the software.
●In section 3.6.4, Low Energy Timer (LETIMER) lowest energy mode updated
●PTI description in section 7.3.2 Packet Trace Interface (PTI) updated
●In section, 9.1 package outline updated.
●In sections 9.2, the dimensions for recommended PCB Land Pattern updated
●In sectiond 9.3, package marking images and description updated
●The text in section 11.3 about CE marking updated
●In section 11.7 KC South Korea certification updated
For the MGM13P v1.2 the changes are
●In the front page block diagram, the lowest energy mode for LETIMER updated.
●Removed Wake On Radio references wherever applicable since this feature is not supported by the software.
●Removed multiprotocol from protocol stack Table 2.1 Ordering Information on page 3.
●In section 3.2, Radio overview updated.
●In section 3.6.4 Low Energy Timer (LETIMER) lowest energy mode updated.
●DCDC Low Power Mode configuration note in Table 4.4 and Current Consumption 3.3 V using DC-DC Converter updated on page 21.
●Wording in Table 4.23 Voltage Monitor (VMON) on page 33 updated.
●VDAC test conditions for EM2 current consumption Table 4.26 Digital to Analog Converter (VDAC) updated on page 39.
●Register name IREFPROG for CSEN test conditions Table 4.28 Capacitive Sense (CSEN) updated on page 44.
●Insection 7.3.2, PTI description Packet Trace Interface (PTI).
●Package drawing and specifications in section 9.1 Package Outline updated.
●In section 9.2, the dimensions of recommended PCB land pattern updated.
●In section 9.3, Package Marking images and description updated.
●Additional text in section 10, Soldering Recommendations.
●The text in section 11.3 CE certification updated.
●Added Certification number in section 11.7 KC South Korea certification.
●Minor wording change regarding peripheral modules
●Reason for Change:Correct errors in the existing part numbers.Original PCN Change Reason:Datasheet revision update.
●Impact on Form, Fit, Function, Quality, Reliability:There is no impact on Form, Function, Quality and Reliability. Customer is advised to review the change in recommended Land Pattern in the datasheet.
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BGM13P 、 MGM13P 、 BGM13P22F512GA-V2 、 BGM13P22F512GA-V2R 、 BGM13P22F512GE-V2 、 BGM13P22F512GE-V2R 、 BGM13P32F512GA-V2R 、 BGM13P32F512GE-V2 、 BGM13P32F512GE-V2R 、 MGM13P02F512GA-V2R 、 MGM13P02F512GE-V2 、 MGM13P02F512GE-V2R 、 MGM13P12F512GA-V2R 、 MGM13P12F512GE-V2 、 MGM13P12F512GE-V2R 、 BGM13P32F512GA-V2 、 MGM13P12F512GA-V2 、 MGM13P02F512GA-V2 、 BGM13S 、 MGM13S |
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PCN/EOL |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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6/2/2020 |
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2020-06-02-791;200602791 |
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724 KB |
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