【PCN】Central Semiconductor CPR5U-040 enhancements to the wafer process Product / Process Change Notice (PCN #185)
●Parts Affected:CPR5U-040 glass passivated ultra fast recovery rectifier.
●Reason for Change:To enhance product manufacturability.
●Extent of Change:The equipment used to apply glass slurry prior to high temperature cure wasupgraded to improve repeatability and consistency. In addition, enhancements to the wafer process were implemented, seeking to optimize forward voltage and reverse characteristics (switching and leakage).
●Effect of Change:This change does not affect the form, fit, or function of the device.
●Effective Date of Change:May 15, 2020.
●Sample Availability:Please contact your salesperson or manufacturer’s representative.
●Qualification:Standard evaluation and qualifications completed resulting inno performance differences compared to current product.
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glass passivated ultra fast recovery rectifier 、 ultra fast recovery rectifier |
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PCN/EOL |
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Please see the document for details |
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GPR-4AM |
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English Chinese Chinese and English Japanese |
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May 15, 2020 |
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PCN #185 |
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355 KB |
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