Thermal Characteristics of IDT'S PES16T4AG2, PES24T3G2, PES24T6G2, HI0524G2PS PCI Express® Switches Application Note
●Introduction:
■An effective thermal management strategy is a critical part of any system design. It is therefore essential that IC vendors provide system designers with pertinent thermal characteristics for their devices. IDT provides basic thermal data for each PCI Express switch in the device data sheet, available from IDT. For most usage scenarios, the information contained in the device data sheet is sufficient to determine the proper thermal management strategy. This application note contains all of the information in the data sheets, as well as additional details on the thermal characteristics of each device.
■The purposes of this application note, with respect to each device in the IDT PCI Express switch family, are:
▲Present relevant thermal parameters (raw data).
▲Provide detailed reference tables, exhibiting PCB (Printed Circuit Board) size vs. number of layers vs. air flow, which customers can use to quickly ascertain heat sink requirements.
▲Enable customers to determine the appropriate thermal management strategy for their specific usage scenarios using the raw data.
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PES16T4AG2 、 PES24T3G2 、 PES24T6G2 、 HI0524G2PS 、 16T4AG2 、 24T3G2 、 24T6G2 |
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Application note & Design Guide |
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Please see the document for details |
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BGA |
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English Chinese Chinese and English Japanese |
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January 30, 2009 |
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AN-544 |
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911 KB |
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