2010 Series / 8.5x8.5x4mm (Square) / Time-Lag Type
●Product Features / 产品特性
■Materials
■材质
▲Body / 本体:thermoplastic / 耐热性塑料 UL94 V-0
▲Lead / 引线:tinned copper wire / 镀锡铜线
■Operating Temperature
■操作温度
▲-55℃ to +125℃ (consider de-rating / 需考虑温度折减)
■Solderability
■可焊性
▲260°C, ≤ 3s. (wave / 波峰焊)
▲350±10°C, ≤ 3s. (soldering iron / 烙铁焊)
■Resistance to Soldering Heat
■耐焊接热
▲260°C, 10s. (wave / 波峰焊)
▲350°C, 3s. (soldering iron / 烙铁焊)
■Recommended Soldering Parameters
■建议焊锡参数
▲Wave soldering parameter / 波峰焊
▲Soldering pot temperature / 锡炉温度:260°C Max
▲Solder dwell time / 焊接时间:2∼5s
▲Hand welding parameter / 手工焊
▲Soldering iron temperature / 烙铁温度:350±5°C
▲Solder dwell time / 焊接时间:1~2s Max.
■Storage Conditions
■储存条件
▲Can be stored for 3 years under tight seal condition at temperature of +10℃~60℃, relative humidity ≤ 75%.
▲在温度+10℃~60℃,相对湿度 ≤ 75% 的密闭条件下可存放 3 年。
▲At most can be kept 30 days at temperature +10℃~60℃, relative humidity ≤ 95% under covered conditions.
▲在温度+10℃~60℃,相对湿度为 95% 的非露天下最多可存放 30 天。
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019/10/17 |
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328 KB |
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