R500 Dispensable Water-Soluble Solder Paste for Leaded Alloys
●Kester R500 is a water-soluble solder paste formula specifically designed as a consistent dot dispensing paste for automated dispense equipment. This solder paste exhibits excellent wetting characteristics in a wide range of profiles. The activator package in this formula is extremely aggressive. It is active enough to remove tenacious oxide layers or to solder to OSP coated boards. Kester R500 is a water soluble formula that maintains its activity and tackiness characteristics for up to 8 hours.
●Performance Characteristics:
■Excellent dispensing characteristics using 21 gauge needles and Type 3 powder
■Capable of dispensing rate of 4 dots per second
■Leaves bright/shiny solder joints after reflow
■Packaged Void-Free
■Scrap is reduced due to minimal paste clogging and separation
■Residues easily removed with DI water
■Classified as ORM0 per J-STD-004
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[ Leaded Alloys ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/12/14 |
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298 KB |
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