Realtek RTL8723BS Combo LGA Module Product Specification
●Over view
■F23BDSM23-W2 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array) footprint, board size is 12mm*12mm with module thickness of 2mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides SDIO interface for WiFi to connect with host processor and high speed UART interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.
■F23BDSM23-W2 uses Realtek RTL8723BS, a highly integrated WiFi/BT single chip based on advanced COMS process. RTL8723BS integrates whole WiFi/BT function blocks into a chip, such as SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB. The general block diagram for the module is shown in Figure 1
●Product Features
■Operate at ISM frequency bands (2.4GHz)
■SDIO for WiFi and UART for Bluetooth
■IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i
■Fully Qualified for Bluetooth 2.1+EDR specification including both 2Mbps and 3Mbps modulation mode
■Fully qualified for Bluetooth 3.0
■Fully qualified for Bluetooth 4.0 Dual mode
■Full–speed Bluetooth operation with Piconet and Scatternet support
■Enterprise level security which can apply WPA/WPA2 certification for WiFi.
■WiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbps upstream PHY rates
|
[ tablet PC ][ ultra book ][ mobile device ][ consumer products ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2015-04-03 |
|
|
Rev 0.3 |
|
|
|
|
|
869 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
