BZT52C2V0
●FEATURES
■Planar die construction.
■500mW power dissipation on ceramic PCB.
■General purpose, medium current.
■Ideally suited for automated assembly processes.
■RoHS compliant package
BZT52C2V0 、 BZT52C51 、 BZT52C2V4 、 BZT52C2V7 、 BZT52C3V0 、 BZT52C3V3 、 BZT52C3V6 、 BZT52C3V9 、 BZT52C4V3 、 BZT52C4V7 、 BZT52C5V1 、 BZT52C5V6 、 BZT52C6V2 、 BZT52C6V8 、 BZT52C7V5 、 BZT52C8V2 、 BZT52C9V1 、 BZT52C10 、 BZT52C11 、 BZT52C12 、 BZT52C13 、 BZT52C15 、 BZT52C16 、 BZT52C18 、 BZT52C20 、 BZT52C22 、 BZT52C24 、 BZT52C27 、 BZT52C30 、 BZT52C33 、 BZT52C36 、 BZT52C39 、 BZT52C43 、 BZT52C47 |
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Datasheet |
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Please see the document for details |
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SOD-123 |
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English Chinese Chinese and English Japanese |
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2019/04/09 |
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Rev. A |
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795 KB |
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