TG-S808 Thermal Compound
●Thermal Compound: TG-S808 is a silicone based thermal grease that has been designed for high performance CPUs and similar applications. It has a thermal conductivity of 8 W/mK, superior wetting characteristics, resulting in a very low thermal resistance and excellent long term reliability.
●Features:
■High thermal conductivity
■Good levelling agent
■Low pump-out
■Low thermal impedence/thermal resistance
■High stability
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[ Electronic components ][ IC ][ CPU ][ MOS ][ LED ][ Heat Sink ][ LCD ][ TV ][ Notebook PC ][ PC Telecom Device ][ Wireless Hub ][ DDR II Module ][ DVD Applications ][ Hand-set applications ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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13062019 |
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Version 1. |
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673 KB |
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