TSM-DS3b Dimensionally Stable Low Loss Laminate Technical Data Sheet
●TSM-DS3b is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3b is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rivals epoxies in fabricating large format complex multilayers.
●TSM-DS3b was developed for high power applications (thermal conductivity = 0.65 W/M*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3b was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.
●A TSM-DS3b core combined with fastRise™27 (Df = 0.0014 at 10 GHz) prepreg is an industry leading solution for the lowest possible dielectric losses that can be attained at epoxy-like 420 ̊F fabrication temperatures. The low insertion losses of TSM-DS3b/fastRise™27 are only rivaled by fusion bonding (the melting of pure Teflon® laminates from 550 ̊F to 650 ̊F). Fusion bonding is expensive, it causes excessive material movement and it puts stress on plated through holes. For complex multilayers, the price of poor yield drives up the final material cost. fastRise™27 enables the sequential lamination of TSM-DS3b at a low 420 ̊F with consistency and predictability that reduces cost.
●For microwave applications, the low x, y and z CTE values assure that critical spacings between traces in filters and couplers have very low movement with temperature. TSM-DS3b can be used with very low profile copper foils yielding a smooth copper edge between coupled lines.
●Registration over many layers is critical for yield and variations in copper weight and copper etching across a panel can cause non-linear movement. Non-linear movement over large panels leads to a lack of registration of the drilled hole to the pad and possibly open circuits.
●TSM-DS3b is compatible with Ticer® and OhmegaPly® resistive foils. Resistor foil stability is best achieved when laminating at low temperatures using Taconic’s fastRise™ family of prepregs.
●TSM-DS3b is intended for RF circuitry and requires OEM design validation for digital circuitry.
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TSM-DS3b 、 TSM-DS3b-0050-ULPH 、 TSM-DS3b-0050-C1 、 TSM-DS3b-0010 、 TSM-DS3b-0050 、 TSM-DS3b-R 、 TSM-DS3b-0050-CI 、 TSM-DS3b-0050-CI-18 |
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[ Couplers ][ Phased Array Antennas ][ Radar Manifolds ][ mmWave Antenna ][ mmWave Automotive ][ Oil Drilling ][ Semiconductor Testing ][ ATE Testing ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019/06/13 |
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1.9 MB |
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