EZ-IO-F Spread Weave Next Generation Laminate technical data sheet
●EZ-IO-F is a thermally stable composite based on nanotechnology, spread weave, and PTFE. Nanoparticle silica insures a drill quality on par with FR4 materials. EZ-IO-F is based on a very low (~10 wt%) fiberglass content. The nature of the spread weave provides a uniform dielectric constant and impedance as suggested by skew testing. EZ-IO-F was created for the next generation of digital circuitry where digital transmission speeds start at 25 gbps and reach 112 gbps. EZ-IO-F was also designed for microwave applications operating at increasingly higher frequencies where there is a need to combine both digital and microwave circuitry onto one PWB. EZ-IO-F was developed to challenge the best FR4 materials at the fabricator level in the most difficult 30-40 layer digital applications.
●Skew testing suggests a maximum skew of 0.3 picoseconds/inch and an average skew of <0.1 ps/inch with no artwork rotation. Artwork rotation of 15° shows a maximum skew of ~0.05 ps/inch and an average skew close to zero. Interestingly enough, skew is flat over frequency when tested from 1-20 GHz.
●EZ-IO-F is manufactured on industry leading no profile copper. The newer ULP copper outperforms rolled copper and is the new benchmark for high performance laminates. Significant reductions in insertion loss can be achieved with ULP copper vs. HVLP or rolled copper.
●EZ-IO-F is best combined with Taconic’s FR28-0040-50S (DF = 0.0018 @ 10 GHz) non-reinforced prepreg to achieve a stripline channel having ~5 wt% fiberglass. Taconic’s fastRise™ prepregs are the lowest loss prepregs commercially available that can be laminated at FR4-like 420 °F lamination temperatures. The low insertion loss of EZ-IO-F/ fastRise™ is only rivaled by the fusion bonding of pure PTFE laminates, an expensive process which causes excessive movement. fastRise™ is typically used at 77 GHz and will compete favorably with any fusion bonded laminate without the cost and challenges of fusion bonding.
● EZ-IO-F can be obtained with the lowest profile resistor foils. The nanoparticle’s design and lack of surface porosity enable the etching of very fine lines (2-4 mil lines and spaces).
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[ Test ][ measurement ][ Optical data transport ][ backplane routers ][ Space ][ defense ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019/06/13 |
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