AN11753 Thermal considerations BGA3131 Application note
●Introduction
■This document provides guidelines for designing the thermal management when applying the BGA3131. It must be noted that the guidelines are general and must be checked against the actual application conditions.
■In the BGA3131 datasheet a Delphi model (compact thermal model) can be found. This can be used to predict the BGA3131 junction temperature in an application based thermal simulation. In addition, on the BGA3131 PIP (product information page) a FloTherm model can be found.
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Delphi model 、 compact thermal model 、 FloTherm model 、 upstream amplifier |
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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23 March 2017 |
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Rev. 2 |
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AN11753 |
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573 KB |
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