Selection Guide Thermal Management For LED Applications
Light Emitting Diodes (LEDs) have been around for years, primarily concentrated in such markets as cell phones, PDAs and other consumer electronics. Since most of these products have relatively short lifecycles, protecting LEDs wasn’t a primary concern because the product would fail or become obsolete long before the LED failed. Today, as technological advancements in LED design and processes are continually boosting light output to rival incandescent, fluorescent, and even halogen light sources, the need to protect the LEDs against heat build‑up is greater than ever before. Three and five‑watt LEDs are now commonplace, and industry experts are predicting 10‑watt LED availability in the next few years. Power LEDs of greater than one‑watt are almost always surface mounted devices. This is because the axial leads to the die in a leaded package do not conduct enough heat away from the LED. Chip‑on‑board (COB), ceramic submounts and other thermally efficient packages are emerging as the standard thermal management packaging solution for Power LEDs.
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Light Emitting Diodes (LEDs) 、 THERMAL CLAD Board 、 Metal Core PCB 、 Printed Circuit Boards (PCB) 、 Thermally Conductive Adhesives 、 Compounds 、 Fillers 、 PA (Pre‑applied) Substrates 、 Adhesive 、 Thermal Interface Compound 、 Gap Filler 、 Silicone GAP PAD 、 Silicone‑Free GAP PAD |
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[ LED Applications ][ cell phones ][ PDAs ][ consumer electronics ] |
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Selection guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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02/16 |
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1.4 MB |
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