Selection Guide Thermal Interface Materials

2022-12-02

BERGQUIST

GPHC3.0-0.020-02-0816-NAGPHC5.0-0.020-02-0816-NAGP1000HD-0.020-02-0816-NAGP1000SF-0.010-02-0816HC100-0.015-02-0816-NAGP1450-0.020-02-0816-NAGP1500-0.100-02-0816-NAGP1500R-0.020-02-00-ACME10256GP15--S30-0.020-02-0816-NAGPA2000-0.010-02-0816-NAGP2000S40-0.020-02-0816-NAGP2200SF-0.010-02-0816-NGPA3000-0.015-02-0816-NAGPS3500ULM-0.020-02-0816-NAGP5000S35-0.020-02-0816-NAGPEMI1.0-0.020-02-0816-NAGF1000-00-15-50cc-NAGF1000SR-00-60-50cc-NAGF1100SF-00-240-400cc-NAGF1400SL-00-120-120cc-NAGF1500-00-60-10G-NAGF1500LV-00-120-120cc-NAGF2000-00-60-10G-NAGF3500LV-00-240-50cc-NAGF3500S35-00-60-400cc-NAGF4000-00-240-50cc-NATIC1000A-00-00-25cc-NATIC4000-00-00-200cc-NALF2000-00-00-5G-NALF3500-00-00-4.3G-NAHF105-0.0055-AC-12/250-NAHF225FAC-0.004-AC-11/250-NAHF225UT-0.003-01-10/250-NAHF300P-0.001-00-00-ACME10256HF56UT-.0005-02-00-ACME10256HF625-0.005-AC-1212-NAHF650P-0.001-01-00-ACME10256SP400-0.007-AC-12/250-NASP800-0.005-AC-1212-AASP900S-0.009-AC-00-ACME 951753SP980-0.009-AC-00-ACME 951753SP1100ST-0.012-02-00-NASP1200-0.009-AC-00-NASPA1500-0.010-AC-12/250-NASP1500ST-0.008-02-1012-NASP2000-0.010-AC-00-NASPA2000-0.015-00-1012-NASPK4-0.006-00-11.512-NASPK6-0.006-00-11.512-NASPK10-0.006-00-11.512-NAQII-0.006-AC-1212-NAQ3-0.005-AC-12/250-NAPP400-0.009-00-1212-NAPP1000-0.009-00-1212-NAPPK4-0.006-00-11.512-NAPPK10-0.006-00-11.512-NABP100-0.008-00-1112-NABP400-0.005-00-11/250-NABP660P-0.008-00-12/250-NABP800-0.005-00-1212-NABPLMSHD-0.010-00-12/100-NALBEA1805-00-30-50cc-NALBSA1000-00-00-30cc-NALBSA1800-00-00-30cc-NALBSA2000-00-00-30cc-NALBSA3505-00-240-50cc-NA

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Thermal Interface MaterialsGAP PAD Thermally Conductive MaterialsGap Filler Liquid Dispensed MaterialsHI-FLOW Phase Change Interface MaterialsThermally Conductive InsulatorsGrease Replacement MaterialsBonding - Thin FilmBonding - FiberglassBonding - UnreinforcedBonding - LaminatesSIL PAD - FiberglassSIL PAD - Thin Film PolyimideGAP PADGap FillerLiquid AdhesiveGAP PAD Thermal Interface MaterialsThermally Conductive MaterialThermally Conductive Low Modulus MaterialThermally Conductive Gap Filling MaterialSilicone-Free Gap Filling Material“Gel-Like” Modulus Gap Filling MaterialReworkable Gap Filling MaterialUnreinforced Gap Filling MaterialReinforced Gap Filling MaterialReinforced “S-Class” Gap Filling MaterialUltra-Low Modulus MaterialEMI Absorbing MaterialLiquid Gap Filling MaterialLiquid Gap Filler MaterialThermally Conductive Grease CompoundsValue CompoundLiquid Formable MaterialLiquid Formable Gel MaterialPhase Change Coated Aluminum MaterialPhase Change Thermal Interface MaterialPressure Sensitive Phase Change Thermal Interface MaterialThermally Conductive Phase Change MaterialReinforced Phase Change Thermal Interface MaterialSIL PAD Thermally Conductive InsulatorsOriginal SIL PAD MaterialHigh Performance InsulatorSoft Tack Elastomeric MaterialThermally Conductive Elastomeric MaterialHigh Reliability InsulatorPolyimide-Based InsulatorMedium Performance Polyimide-Based Insulatore High Performance Polyimide-Based InsulatorGlass-Reinforced Grease Replacement Thermal InterfaceThermally Conductive Insulation MaterialThermally Conductive TubesBOND-PLY and LIQUI-BOND AdhesivesBOND-PLY Adhesive TapesLIQUI-BOND Liquid AdhesivesFiberglass-Reinforced Pressure Sensitive Adhesive TapePressure Sensitive Adhesive TapeLiquid Epoxy AdhesiveLiquid Silicone Adhesive

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Selection guide

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