Comprehensive Selection Guide THERMAL CLAD
■Overview:
●THERMAL CLAD is a complete thermal management system, unlike traditional technology which uses heat sinks, clips and other mounting hardware. THERMAL CLAD enables low-cost production by eliminating the need for costly manual assembly.
■Dielectric Layer
●The technology of THERMAL CLAD resides in the dielectric layer. It is the key element for optimizing performance in your application. The dielectric is a proprietary polymer/ceramic blend that gives THERMAL CLAD its excellent electrical isolation properties and low thermal impedance.
●The polymer is chosen for its electrical isolation properties,ability to resist thermal aging and high bond strengths. The ceramic filler enhances thermal conductivity and maintains high dielectric strength. The result is a layer of isolation which can maintain these properties even at 0.0015'' (38μm) thickness.
■Benefits
●RoHS and Reach compliant and halogen-free
●Lower component operating temperatures
●Reduce printed circuit board size
●Increase power density
●Extend the life of dies
●Reduce the number of interconnects
●Improve product thermal and mechanical performance
●Combine power and control
●Improve product durability
●Enable better use of surface mount technology
●Reduce heat sinks and other mounting hardware,including thermal interface material
●Replace fragile ceramic substrates with greater mechanical durability
●Henkel is your one-stop source from raw materials to finished circuit boards
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HPL-03015 、 HT-04503 、 HT-07006 、 MP-06503 、 HR T30.20 、 HT-09009 、 CML-11006 |
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[ automotive ][ audio ][ motor control applications ][ power conversion applications ][ Solid State Relays ][ Solid State Switches ][ Motor Drives ][ LEDs ][ High Power Lighting Applications ] |
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Selection guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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0217 |
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Rev. 0217 |
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15.2 MB |
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