2929 Bondply Data Sheet
intended for use in high performance, high reliability multi-layer constructions.
A low dielectric constant (2.9) and loss tangent (<0.003) at microwave
frequencies makes it ideal for bonding multi-layer boards (MLB’s) made using
PTFE composite materials such as RT/duroid® 6000, RO4000® and RO3000®
series laminates. The proprietary cross-linking resin system makes this thin fi lm
adhesive system compatible with sequential bond processing while controlled
fl ow characteristics offer blind via fi ll capability and potentially predictable
cutback ratios for designs requiring blind cavities.
2929 bondply is compatible with traditional fl at press and autoclave bonding.
The fi lm is currently available in 0.0015”, 0.002” and 0.003” sheet thicknesses
(0.038mm, 0.051mm, and 0.076mm). Individual sheets can be stacked to
yield thicker adhesive layers. The unreinforced thin fi lm can be tack bonded
to inner-layers to ease simultaneous machining of cut-outs through core and
adhesive layers. An easy-to-release carrier fi lm protects the adhesive layer from
contamination during the machining and MLB booking processes
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[ Automotive Radar and Sensors ][ Point-to-point Microwave ][ Base Station Antennas ][ Power Amplifi ers ][ Phased Array Radar ][ RF Components ][ Patch Antennas ][ Power Backplanes ] |
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Datasheet |
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Lead-Free |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2017/08/01 |
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Publication #92-159 |
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207 KB |
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