SUPER LOW PROFILE SIM H=1.95 WITH FLANGE
●CONTACT: COPPER ALLOY
■ALL OVER Ni : 1.27μm MIN.
■CONTACT AREA PdN i :1.0μm MIN. Au: 0.2μm MIN.
■SOLDERING AREA Au: 0.05μm MIN.
●CLIP：SUS
■ALL OVER Ni: 1.3μm MIN.
■Tin: I urn MIN(ZONE I).
■HOUSING: THERMOPLASTIC
●RECOMMENDED SOLDERING THICKNESS: 100μm MIN.
■RECOMMENDED SOLDERING AREA:100% OF REFERENCE LAYOUT PATTERN
●COPLANARITY: 0.1MAX. (SEE F IG. I ) REFERENCE PICK &
●PLACE AREA.
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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19JAN2012 |
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REVB |
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C-1932768 |
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234 KB |
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